MORCHEM will take part in PACKEXPO INTERNATIONAL 2014, held from 02nd to 05th November in Chicago / USA. PACKEXPO is the most important trade fair in the US market for Flexible Packaging. MORCHEM will present its high-end product range of solvent-based and solvent-free adhesives for flexible packaging lamination, functional coatings and its TPU range for the production of printing inks.
We are looking forward to welcoming you in our booth: E5680.
https://www.morchem.com/wp-content/uploads/2016/12/morchem-logo-web-1.jpg00taoshttps://www.morchem.com/wp-content/uploads/2016/12/morchem-logo-web-1.jpgtaos2017-02-06 09:59:462017-02-06 09:59:46PACKEXPO INTERNATIONAL IN CHICAGO 2014
For over 60 years we represent specialty experience in PU technologies.