PACKEXPO INTERNATIONAL IN CHICAGO 2014
MORCHEM will take part in PACKEXPO INTERNATIONAL 2014, held from 02nd to 05th November in Chicago / USA. PACKEXPO is the most important trade fair in the US market for Flexible Packaging. MORCHEM will present its high-end product range of solvent-based and solvent-free adhesives for flexible packaging lamination, functional coatings and its TPU range for the production of printing inks.
We are looking forward to welcoming you in our booth: E5680.
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