MORCHEM will take part in PACKEXPO INTERNATIONAL 2014, held from 02nd to 05th November in Chicago / USA. PACKEXPO is the most important trade fair in the US market for Flexible Packaging. MORCHEM will present its high-end product range of solvent-based and solvent-free adhesives for flexible packaging lamination, functional coatings and its TPU range for the production of printing inks.

We are looking forward to welcoming you in our booth: E5680.

0 replies

Leave a Reply

Want to join the discussion?
Feel free to contribute!

Leave a Reply

Your email address will not be published. Required fields are marked *

This site uses Akismet to reduce spam. Learn how your comment data is processed.