MORCHEM AGAIN AT PACK EXPO CHICAGO

14th till 17th October 2018 – McCormick Place – Chicago, Illinois

This biennial quality trade show, focused on processing and packaging innovations, brings together attendees and key professionals from a wide variety of prominent consumer packaged goods companies and retailers. MORCHEM, will once more participate presenting  its new developments and innovations, always with food safety and sustainability as a main priority.

We look forward to meeting you at our booth # E-8836.

For more information about the show, please visit https://www.packexpointernational.com/

 

MORCHEM NEW CEFLEX STAKEHOLDER

Last 19th of September’18 , MORCHEM participated in the general meeting of CEFLEX held in Darwen, UK as a new stakeholder. Our aim is to contribute as adhesive manufacturer in this consortium initiative which its mission is to enhance the performance of flexible packaging in the circular economy. More than 90 companies and associations representing the entire value chain of flexible packaging joined CEFLEX and the number of stakeholders is growing . CEFLEX activity is focused in seven workstreams which are already quite developed : to design the guidelines for the flexible packaging in the circular economy, identify and develop sustainable end markets for secondary materials, business case for collecting flexible packaging, identification and support of the most promising technologies which can further enable sorting and recycling and communication with all relevant external stakeholders.

MORCHEM PRESENT AGAIN AT FACHPACK

The Packaging Industry meets from 25 to 27 September 2018 in the Exhibition Centre Nuremberg

In a 3-day-progamme FACHPACK brings together more than 1.500 exhibitors showing the new trends, perspectives and opportunities within the packaging process chain and showcasing new innovations and developments with more than 40.00 professional visitors from the packaging-intensive sectors.

Once again MORCHEM is happy to attend this important exhibition to support you in all adhesive-related issues and as a meeting point to exchange our latest experiences.

We look forward to welcoming you at our booth no.7A-747 (Hall 7A – same location as last edition).

For more information about FACHPACK, please visit www.fachpack.de

7TH SPECIALTY FILMS & FLEXIBLE PACKAGING GLOBAL SUMMIT 2018

4 – 5 September, Grand Hyatt, Mumbai, India

We are pleased to announce that MORCHEM is Gold Partner at this year’s Specialty Films & Flexible Packaging Global Summit, taking place on 4th – 5th September in Mumbai.

This important event, dedicated to the largest converting segment of the polymer processing industry in India, brings together key professionals from over 25 countries and provides an unmatched platform to interact with key decision makers as well as networking opportunities with the representatives of the flexible packaging value chain.

MORCHEM looks forward to meeting you in September at the Grand Hyatt Mumbai.

MORCHEM OUTLINES CONFERENCE AT HISPACK 2018

         Barcelona, 8 – 11 May 2018

The Hispack packaging trade show –marked by digitalization and sustainability – closes a successful edition with almost 40.000 visitors.

Moreover, the Hispack Challenge space achieved its goal of defying the challenges of packaging with the help of sector experts and all the participants at the sessions.

MORCHEM, together with DUCPLAST, DULCESOL, QUIMOVIL and COMEXI, participated at the conferences promoted by AIMPLAS and GRAPHISPACK. Represented by Javier Gutiérrez and Antoni Segovia, with a presentation titled “Challenge: Elimination of VOCs (Volatile Organic Compounds) in lamination”, they showcased new solutions for a more sustainable, digitalized and efficient packaging industry.

Once again, MORCHEM’s attendance at the exhibition confirmed the sector’s high interest in new solutions for more sustainable and high value-added adhesives.

All in all it was a great success with high quality visitors.

 

MORCHEM AGAIN PRESENT AT THE SPECIALTY PACKAGING FILMS ASIA 2018

One more year, MORCHEM has participated at AMI’s 5th Asia-Pacific International Conference on markets and technology of flexible packaging., represented by our Business Managers of India, MEA+SEA, Central Europe and our R&D Director from Spain.

The aim of the conference is to bring together professionals and experts working in the flexible packaging industry across the Asia-Pacific region in order to discuss and share key issues and future trends in packaging performance, processability and sustainability.

And exactly that was the topic approached by our speaker, Mr. Juan Sanchez, Business Manager of our offices in Dubai and responsible for the MEA and SEA region, with his presentation about “FUTURE TRENDS IN FLEXIBLE PACKAGING.

In addition, our table-top in the conference hall offered comprehensive information about our product portfolio.

All in all, the conference was very productive and a great participation success with over 115 representatives from around 25 countries.

 

MORCHEM EXHIBITS AT CHINAPLAS 2018

We are pleased to inform you that MORCHEM, for the first time, will exhibit at CHINAPLAS 2018, in Shanghai, Asia’s #1 Trade Fair for the Plastics & Rubber Industries, and important meeting and business platform.

MORCHEM will present its wide portfolio of specialty adhesives & coatings for flexible packaging lamination, specially focusing on SF adhesives for aluminium foil applications, high speed and retort with food safety as our first priority.

We are looking forward to welcoming you in our booth # K71 in Hall 4.2.

For more information please visit www.chinaplasonline.com

 

 

MORCHEM at the XII FORUM FOR IQS ENTERPRISES

A very positive experience

Last 7th March, the IQS School of Engineering organized in Barcelona for the 12th consecutive year, the IQS Enterprise Forum, inviting enterprises from different industrial sectors and activities, with the participation of companies such as DOW, HENKEL, BASF, COVESTRO, GRIFOLS, etc.

MORCHEM, represented by our HR Department, participated actively at the forum, with the purpose to bring our company closer to last grade or master level students of Chemical Engineering and present the professional profiles we are looking for.

The enterprises, a part from table tops offering information about their companies, were able to participate in round tables to discuss the different strategies used for attracting talents.

In general, the experience was very positive and we could give IQS students visibility for MORCHEM and provide them direct contact to our company.

MORCHEM’S INTERNATIONAL SALES MEETING 2017

14 – 15th November at IESE Business School

Once again, we held our yearly International Sales Meeting at the IESE Business School in Barcelona.

MORCHEM’S worldwide sales team was thus able to share the business opportunities and news of the World Markets as well as the future trends in the adhesive & coatings technology.

We specially would like to thank Prof. Pedro Nueno, Emeritus Professor of Entrepreneurship, IESE and Professor and President CEIBS (Shanghai) for his most interesting speech held during our meeting. It was a real pleasure to listen to his words and lively anecdotes.

The meeting was a great opportunity to stay together and to confirm our mission to be as close as possible to our customers.

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MORCHEM SPONSORS TECHNICAL CONFERENCE ORGANISED BY AIMPLAS

The conference, held successfully on October 18 at AIMPLAS, in Valencia, was characterized by the presentation of the latest developments and innovations in the flexible packaging sector, specially focusing on laminated structures. Technical and legislative aspects were addressed, as well as relevant issues about packaging sustainability.

MORCHEM sponsored and participated as a speaker, represented by Javier Gutiérrez, at the same time moderator of the event, which has counted with numerous professionals of the sector, among whom were experts from firms such as SYNAPTIK, COMEXI, HP, VALCO- MELTON and QUIMÓVIL.

We thank AIMPLAS and all the collaborators of the event for the opportunity provided while waiting for the next edition.